Process Engineer Intern Summer PT during school year

Profile

,AnswerValue:PROCESS ENGINEERING INTERN FOR 3D AND HETROGENEOUS INTEGRATION\u003cbr/\u003eAlbany, NY\u003cbr/\u003e*not remote role, role requires time at the on-site lab/cleanroom.\u003cbr/\u003e\u003cbr/\u003eProcess engineering intern for 3D integration/heterogeneous integration activities (3DI/HI). \u003cbr/\u003eThe 3DI/HI Group at TTCA focuses on Heterogeneous Integration R\u0026D, including Wafer to Wafer (W2W) Fusion and Hybrid Bonding, TSV formation and Wafer Thinning for use in semiconductor manufacturing. We optimize the processes and hardware used to stack integrated circuits for advanced 3D applications including CMOS image sensors and memory devices. 3DI/HI intern will work closely with 3DI/HI engineers \u0026 scientists to support technology developments.\u003cbr/\u003e\u003cbr/\u003eResponsibilities:\u003cbr/\u003e\tConduct process experiment design and the execution. \u003cbr/\u003e\tSupport process engineer and scientist for process development. \u003cbr/\u003e\tConduct physical analysis and metrology measurement. \u003cbr/\u003e\tAid in data analysis and statistical correlations to accelerate process evaluations.\u003cbr/\u003e\u003cbr/\u003e\u003cbr/\u003eQualifications:\u003cbr/\u003e\tU.S. work authorization is required.\u003cbr/\u003e\tA current college student pursuing bachelors or advanced degree in nano technology, or related field\u003cbr/\u003e\tAbility to take direction and feedback, also work independently when required.\u003cbr/\u003e\tAbility to perform inline measurements with physical analysis tools desired; SEM, FTIR, XPS, AFM, CSAM. If needed, trainings will be provided.\u003cbr/\u003e\tTrainings will be provided for the logistic systems used as well as basic semiconductor process flow if needed.\u003cbr/\u003e\u003cbr/\u003e\u003cbr/\u003eEqual Opportunity Employer/Minorities/Females/Disabled/Veterans\u003cbr/\u003e,

Company info

Tokyo Electron U.S. Holdings, Inc.
Website : http://www.tel.com